06 {{ "2023-11-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-06T00:00:00+00:00" | date "longDate" }}

Intel News

INTEL, DELL POWER UK’S FASTEST AI SUPERCOMPUTER

Dawn, a joint effort by Dell Technologies, Intel, University of Cambridge and UKRI, will launch the UK’s recently announced AI Research Resource to solve academic, industrial computational challenges.

Read more…

06 {{ "2023-11-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-06T00:00:00+00:00" | date "longDate" }}

Rockwell Automation News

ROCKWELL AUTOMATION LAUNCHES MAGNEMOVER LITE OPERATOR RUNTIME TOOL

Product teams can now gain new insights into their MagneMover^® LITE™ Intelligent Conveyor System performance using the MagneMover LITE Operator Runtime Tool.

Read more…

04 {{ "2023-11-04T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-04T00:00:00+00:00" | date "longDate" }}

Dürr Systems AG News

DURR Modular components for scalable plant engineering in the paint shop

EcoProWet PT is a flexible and scalable wet system for body pretreatment that takes much less space and time to build than classic immersion tanks. The system saves on energy and materials, and is particularly suitable for small to medium production capacities.

Read more…

03 {{ "2023-11-03T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-03T00:00:00+00:00" | date "longDate" }}

Toshiba News

New MikroElektronika Click Boards™ feature Toshiba digital isolators for isolated signal transmission in industrial applications

5kVrms/150Mbps 4-channel ICs for SPI, UART, and general I/O isolation now available on evaluation boards.

Read more…

03 {{ "2023-11-03T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-03T00:00:00+00:00" | date "longDate" }}

Congatec News

CONGATEC SHOWCASES HIGH-PERFORMANCE COMPUTING ECOSYSTEMS FOR THE EDGE

Presentations span from fanless rugged edge server designs to secure connectivity solutions for the digitization of brownfield equipment.

Read more…

03 {{ "2023-11-03T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-03T00:00:00+00:00" | date "longDate" }}

IAR Systems News

IAR empowers AI and ML Development with Full Tool Support for Renesas RA8 Series

IAR Embedded Workbench for Arm is geared up to support early adopters of the Renesas RA8 Series MCUs, the first to feature the Arm^® Cortex^®-M85 processor with Arm’s Helium technology.

Read more…

02 {{ "2023-11-02T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-02T00:00:00+00:00" | date "longDate" }}

PEPPERL+FUCHS FACTORY AUTOMATION

One-of-a-kind detection range, multitag capability and seamless integration

Pepperl+Fuchs introduces two high-performance products, combining high-frequency RFID with a unique sensing range in a compact, modern enclosure for efficient identification tasks.

Read more…

02 {{ "2023-11-02T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-02T00:00:00+00:00" | date "longDate" }}

Vishay News

Vishay introduces Intertechnology SuperTan^® Tantalum-Cased Wet Tantalum Capacitors

The STH electrolytic capacitors offer superior reliability in avionics and aerospace applications, offering enhanced military H-level shock (500 g) and vibration (sine: 80g; random: 54 g) capabilities, and increased thermal shock up to 300 cycles.

Read more…

02 {{ "2023-11-02T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-02T00:00:00+00:00" | date "longDate" }}

Hexagon Manufacturing Intelligence News

HEXAGON PRESENTS PRODUCTIVITY-BOOSTING NEXUS CONNECTED WORKER SUITE

The suite offers powerful enterprise-system integration and provides a central location for digital representations of assets, processes, and production facilities to support real-time decision-making.

Read more…

02 {{ "2023-11-02T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-02T00:00:00+00:00" | date "longDate" }}

3D SYSTEMS News

3D SYSTEMS INTRODUCES NEW MATERIALS & TECHNOLOGIES AT FORMNEXT 2023

The company is introducing Accura^® AMX High Temp 300C, SLS 300, a new professional service for C-103, and the DMP Flex 350 Triple — engineered to enable the efficient production of high-quality end-use parts in a breadth of industries.

Read more…

Technical Articles

THE FOUR BUILDING BLOCKS OF THE INDUSTRIAL METAVERSE

Case studies

ELEKTRO-ANLAGEN RÖRING GMBH EQUIPS BIOGAS PLANTS WITH YASKAWA AC DRIVES

INTEL, DELL POWER UK’S FASTEST AI SUPERCOMPUTER

Dawn, a joint effort by Dell Technologies, Intel, University of Cambridge and UKRI, will launch the UK’s recently announced AI Research Resource to solve academic, industrial computational challenges.

ROCKWELL AUTOMATION LAUNCHES MAGNEMOVER LITE OPERATOR RUNTIME TOOL

Product teams can now gain new insights into their MagneMover^® LITE™ Intelligent Conveyor System performance using the MagneMover LITE Operator Runtime Tool.

DURR Modular components for scalable plant engineering in the paint shop

EcoProWet PT is a flexible and scalable wet system for body pretreatment that takes much less space and time to build than classic immersion tanks. The system saves on energy and materials, and is particularly suitable for small to medium production capacities.

New MikroElektronika Click Boards™ feature Toshiba digital isolators for isolated signal transmission in industrial applications

5kVrms/150Mbps 4-channel ICs for SPI, UART, and general I/O isolation now available on evaluation boards.

CONGATEC SHOWCASES HIGH-PERFORMANCE COMPUTING ECOSYSTEMS FOR THE EDGE

Presentations span from fanless rugged edge server designs to secure connectivity solutions for the digitization of brownfield equipment.

IAR empowers AI and ML Development with Full Tool Support for Renesas RA8 Series

IAR Embedded Workbench for Arm is geared up to support early adopters of the Renesas RA8 Series MCUs, the first to feature the Arm^® Cortex^®-M85 processor with Arm’s Helium technology.

One-of-a-kind detection range, multitag capability and seamless integration

Pepperl+Fuchs introduces two high-performance products, combining high-frequency RFID with a unique sensing range in a compact, modern enclosure for efficient identification tasks.

Vishay introduces Intertechnology SuperTan^® Tantalum-Cased Wet Tantalum Capacitors

The STH electrolytic capacitors offer superior reliability in avionics and aerospace applications, offering enhanced military H-level shock (500 g) and vibration (sine: 80g; random: 54 g) capabilities, and increased thermal shock up to 300 cycles.

HEXAGON PRESENTS PRODUCTIVITY-BOOSTING NEXUS CONNECTED WORKER SUITE

The suite offers powerful enterprise-system integration and provides a central location for digital representations of assets, processes, and production facilities to support real-time decision-making.

3D SYSTEMS INTRODUCES NEW MATERIALS & TECHNOLOGIES AT FORMNEXT 2023

The company is introducing Accura^® AMX High Temp 300C, SLS 300, a new professional service for C-103, and the DMP Flex 350 Triple — engineered to enable the efficient production of high-quality end-use parts in a breadth of industries.

International

Technical Articles

Case studies

Dawn, a joint effort by Dell Technologies, Intel, University of Cambridge and UKRI, will launch the UK’s recently announced AI Research Resource to solve academic, industrial computational challenges.

Product teams can now gain new insights into their MagneMover® LITE™ Intelligent Conveyor System performance using the MagneMover LITE Operator Runtime Tool.

EcoProWet PT is a flexible and scalable wet system for body pretreatment that takes much less space and time to build than classic immersion tanks. The system saves on energy and materials, and is particularly suitable for small to medium production capacities.

5kVrms/150Mbps 4-channel ICs for SPI, UART, and general I/O isolation now available on evaluation boards.

Presentations span from fanless rugged edge server designs to secure connectivity solutions for the digitization of brownfield equipment.

IAR Embedded Workbench for Arm is geared up to support early adopters of the Renesas RA8 Series MCUs, the first to feature the Arm® Cortex®-M85 processor with Arm’s Helium technology.

Pepperl+Fuchs introduces two high-performance products, combining high-frequency RFID with a unique sensing range in a compact, modern enclosure for efficient identification tasks.

The STH electrolytic capacitors offer superior reliability in avionics and aerospace applications, offering enhanced military H-level shock (500 g) and vibration (sine: 80g; random: 54 g) capabilities, and increased thermal shock up to 300 cycles.

The suite offers powerful enterprise-system integration and provides a central location for digital representations of assets, processes, and production facilities to support real-time decision-making.

The company is introducing Accura® AMX High Temp 300C, SLS 300, a new professional service for C-103, and the DMP Flex 350 Triple — engineered to enable the efficient production of high-quality end-use parts in a breadth of industries.

International

Product teams can now gain new insights into their MagneMover^® LITE™ Intelligent Conveyor System performance using the MagneMover LITE Operator Runtime Tool.

IAR Embedded Workbench for Arm is geared up to support early adopters of the Renesas RA8 Series MCUs, the first to feature the Arm^® Cortex^®-M85 processor with Arm’s Helium technology.

The company is introducing Accura^® AMX High Temp 300C, SLS 300, a new professional service for C-103, and the DMP Flex 350 Triple — engineered to enable the efficient production of high-quality end-use parts in a breadth of industries.