19
'21
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ABB News
18
'21
Written on
ANSYS News
Ansys Enables More Sustainable Product Development with Fujitsu
Ansys breaks new ground in green technology leadership through collaboration with Fujitsu, provides reduced cost and enhanced productivity for mutual customers.
18
'21
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Rohde & Schwarz
Rohde & Schwarz validates 10 Gbps end-to-end (E2E) peak downlink IP data throughput
Rohde & Schwarz announced today the next breakthrough in 5G data performance: With support of Qualcomm Technologies, Inc., Rohde & Schwarz has validated 10 Gbps end-to-end (E2E) IP data performance using its R&S CMX500 5G radio communication tester platform. The setup was powered by Snapdragon® X65 5G Modem-RF System, the world’s first 3GPP Release 16 modem-RF system with Qualcomm® QTM545 mmWave Antenna Module.
18
'21
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EPLAN UK
EPLAN Partnering with LCA Group to Support Coleg Cambria’s Electrical Engineering Apprenticeship Training Programme
EPLAN provides software and service solutions for electrical, automation and mechatronic engineers. Founded in 1984 and owned by the international Friedhelm Loh Group, EPLAN is now one of the world’s leading design software solutions with more than 50,000 customers, supported by local teams based in more than 50 countries.
18
'21
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Wenglor News
Robust and Resistant to Cleaning: When Stainless Steel 316L Meets Optical Sensor Performance
Specialists in harsh and demanding industrial environments: Type 2K photoelectronic sensors are the latest additions to the PNG//smart product series.
16
'21
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Phoenix Contact News
THR PCB terminal blocks up to 2.5 mm²
Phoenix Contact is extending its range of reflow-solder-capable PCB terminal blocks (MSL1) to include the 2.5 mm² cross-section.
16
'21
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AT&S News
AT&S continues to invest in its Leoben site
In view of the ongoing boom in demand in the microelectronics sector and ever-new performance requirements for electronic systems, AT&S has decided to put an even stronger focus on research and development. Therefore, the company is investing in a new R&D center for substrate and packaging solutions for the global semiconductor industry at its location in Leoben-Hinterberg. In addition, another technology upgrade of the production facilities will be implemented.
16
'21
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Liebherr News
Bin picking made easy
“Bin picking” is among the most difficult disciplines in automation. Adjusting the parameters for reliable recognition and gripping of complex objects is demanding and requires expertise. LHRobotics.Vision, a software by Liebherr-Verzahntechnik GmbH from Kempten, now makes bin picking much easier for users through Artificial Intelligence (AI).
15
'21
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AMS News
New level of interaction – ams OSRAM expands VCSEL-portfolio for 3D gesture recognition
ams OSRAM (SIX: AMS), a global leader in optical solutions, expands its 3D sensing portfolio with four new VCSEL modules.
15
'21
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Etsi News
