18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Rutronik News

Immerse yourself in the world of embedded systems: Rutronik TechTalk meets embedded world 2021

Stay digital but connected: Rutronik will be presenting products and solutions for the innovation driven markets of embedded, (I) IoT, Industry 4.0, robotics, measurement, logistics, energy, medicine and biotechnology, automation and artificial intelligence at embedded world DIGITAL and as part of the successfully established TechTalk from 2 to 4 March 2021.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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B&R News

B&R among first members of new EPLAN Partner Network

Tighter cooperation for more efficient engineering.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Adlinktech News

ADLINK Technology at Embedded World 2021: Edge AI Strategy and Next-Gen Modules

Market-leading edge AI platforms and GPU computing.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Bluebotics News

BlueBotics’ ANT^® Navigation Drives Autonomous Vehicles Over 10 Million Kilometers

BlueBotics, the global leader in natural feature navigation, has announced its Autonomous Navigation Technology (ANT^®) is now estimated to have driven automated guided vehicles (AGVs) and autonomous mobile robots (AMRs) over 10 million kilometers, in applications ranging from warehousing and manufacturing to commercial cleaning services, UVC disinfection and more.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Stratasys News

STRATASYS ACQUIRES RPS, PROVIDER OF BEST-IN-CLASS STEREOLITHOGRAPHY 3D PRINTERS

Addition of RPS’ Neo line of industrial stereolithography systems gives Stratasys a full suite of polymer 3D printing solutions across the product life cycle.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Congatec News

Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC

congatec to solve ruggedization challenges of edge server and client designs.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Beckhoff News

Integrating data and communication services efficiently into the cloud

TwinCAT IoT now also supports MindSphere^®.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Volume Graphics News

Version 3.4.5: Introducing P 203 Analysis

Version 3.4.5 of VGSTUDIO MAX, VGSTUDIO, VGMETROLOGY, VGinLINE, and myVGL is now available for download. In version 3.4.5, you will benefit from the following new capabilities*.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Swindonsilicon News

Swindon Silicon Systems at Embedded World 2021

Main Theme - Smart Sensors made smarter using custom ICs and SiPs.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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BOBST News

CONNECTING ALL THE PIECES: HOW BOBST CONNECT IS SHAPING THE FUTURE OF THE PACKAGING WORLD

When there is disruption all around, being connected brings stability. In the current packaging environment, there is certainly disruption – not only from the COVID-19 pandemic, but also from ever-increasing competition and pressures around shorter times to market, smaller lot sizes, the need for perfect color consistency and quality control, and to fulfil corporate sustainability commitments.

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Technical Articles

THE FOUR BUILDING BLOCKS OF THE INDUSTRIAL METAVERSE

Case studies

ELEKTRO-ANLAGEN RÖRING GMBH EQUIPS BIOGAS PLANTS WITH YASKAWA AC DRIVES

Immerse yourself in the world of embedded systems: Rutronik TechTalk meets embedded world 2021

B&R among first members of new EPLAN Partner Network

Tighter cooperation for more efficient engineering.

ADLINK Technology at Embedded World 2021: Edge AI Strategy and Next-Gen Modules

Market-leading edge AI platforms and GPU computing.

BlueBotics’ ANT^® Navigation Drives Autonomous Vehicles Over 10 Million Kilometers

STRATASYS ACQUIRES RPS, PROVIDER OF BEST-IN-CLASS STEREOLITHOGRAPHY 3D PRINTERS

Addition of RPS’ Neo line of industrial stereolithography systems gives Stratasys a full suite of polymer 3D printing solutions across the product life cycle.

Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC

congatec to solve ruggedization challenges of edge server and client designs.

Integrating data and communication services efficiently into the cloud

TwinCAT IoT now also supports MindSphere^®.

Version 3.4.5: Introducing P 203 Analysis

Version 3.4.5 of VGSTUDIO MAX, VGSTUDIO, VGMETROLOGY, VGinLINE, and myVGL is now available for download. In version 3.4.5, you will benefit from the following new capabilities*.

Swindon Silicon Systems at Embedded World 2021

Main Theme - Smart Sensors made smarter using custom ICs and SiPs.

CONNECTING ALL THE PIECES: HOW BOBST CONNECT IS SHAPING THE FUTURE OF THE PACKAGING WORLD

International

Technical Articles

Case studies

Tighter cooperation for more efficient engineering.

Market-leading edge AI platforms and GPU computing.

Addition of RPS’ Neo line of industrial stereolithography systems gives Stratasys a full suite of polymer 3D printing solutions across the product life cycle.

congatec to solve ruggedization challenges of edge server and client designs.

TwinCAT IoT now also supports MindSphere®.

Version 3.4.5 of VGSTUDIO MAX, VGSTUDIO, VGMETROLOGY, VGinLINE, and myVGL is now available for download. In version 3.4.5, you will benefit from the following new capabilities*.

Main Theme - Smart Sensors made smarter using custom ICs and SiPs.

International

TwinCAT IoT now also supports MindSphere^®.