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ST News

STMicroelectronics and eYs3D Microelectronics to showcase collaboration on high-quality 3D stereo-vision camera for machine vision and robotics at CES 2023

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and eYs3D Microelectronics, a fabless semiconductor design house that focuses on end-to-end hardware and software systems for computer vision, including advanced vision-processing System-on-Chip (SoC) devices, will reveal the results of their collaboration on high-quality machine vision at CES 2023 in Las Vegas on January 5-8.

Universal Robots News

FIVE AUTOMATION PREDICTIONS FOR 2023: TURNKEY SOLUTIONS ARE THE FUTURE

With rapid workplace transformation evident across industries, whether that’s moving to hybrid working or adopting new technologies, what can we expect from 2023? Anders Beck, Vice President of Strategy and Innovation at Universal Robots, discusses five predictions for the coming year.

Fraunhofer News

FRAUNHOFER: WORKING INTERACTIVELY WITH MIXED-REALITY FACTORY LAYOUTS

Through their HoloLayouts software, researchers at the Fraunhofer Institute for Manufacturing Engineering and Automation IPA have developed an application in which multiple people can collaborate interactively on creating factory layouts that use space efficiently. The factory planning process can be experienced in a virtual environment, with changes made live and in real time.

innodisk

Innodisk DDR5 RDIMM Powers Semiconductor Automatic Optical Inspection

Innodisk, a global leader in industrial-grade storage and embedded peripherals is proud to announce its solution to issues faced by Automated Optical Inspection (AOI) applications relating to, and caused by the shortcomings of consumer DRAM.

Hexagon Manufacturing Intelligence News

Hexagon adds speed, scalability and automation to digital twin creation with the acquisition of LocLab

Hexagon AB, a global leader in digital reality solutions combining sensor, software and autonomous technologies, has announced the acquisition of LocLab, a leader in 3D digital twin content creation. LocLab’s proprietary technology, enabled by a high degree of automation using proven workflows and artificial intelligence, allows the cost- and time-efficient creation of digital twins.

Binder News

Binder: Assemble more efficiently

Crimp variants of the M16 product series from binder simplify wiring, in small quantities on site, but also automated and in larger batches. From the connector itself through the contacts to the suitable crimping tool, everything necessary is available from a single source at binder.

OMRON News

OMRON adds EtherCAT models to i4L SCARA robot series

OMRON’s has announced the availability of new EtherCAT models in the i4L SCARA robot series. The compact i4L robots now offer even stronger performance at the lowest total cost of ownership. Robotic Integrated Controller allows synchronized multi-robot applications with EtherCAT models.

Trumpf News

TRUMPF and STOPA establish strategic partnership for smart-factory solutions

High-tech company TRUMPF has opened up new opportunities for collaboration with STOPA, one of the leading manufacturers of automated storage systems. The two companies recently announced an agreement to work even closer together in the future.

DMG MORI News

DMG MORI: DIGITAL TWIN, DIGITAL MODEL OF THE REAL OBJECT

The Digital Twin only becomes really valuable through the digital model of the real object and its digital image. Digital models are therefore dynamic 3D representations of a real object that can be used for simulations and analyses.

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