Embedded systems are the foundation of today’s electronic devices, spanning sectors as diverse as consumer electronics, telecommunications, industrial, medical, automotive and aerospace applications.
The Fraunhofer IPMS, Dresden and the Max Planck Institute for Microstructure Physics, Halle, are collaborating on innovative spin-based memory and logic components that operate at low temperatures.
The updated Kollmorgen AKD2G servo drive features new communication protocols that support easier integration with third-party controllers while delivering industry-leading performance.
Emerson collaborates with CoreTigo on wireless industrial automation technologies to address compressed air management challenges, reducing energy waste and CO2 emissions, and improving maintenance efficiency.
Phytec unveils the new solder module standard FPSC - Future Proof Solder Core at the embedded world, alongside with the two System on Modules, phyCORE-i.MX 95 and phyCORE-i.MX 8M Plus, which adhere to this standard.