The DFA 1163M is powered by Intel Atom® C3758R processor and features a high-speed I/O configuration, including server-grade SFP+ LAN port, embedded Intel® QuickAssist Technology and 5G mmWave connectivity.
At the Hannover Messe 2023, the Schmersal Group will present for the first time a 3D camera for the automated acquisition of digital process data in real time in Hall 09, Stand D09. The AM-T100 is a Time-of-Flight camera (ToF), which uses a Sony DepthSense sensor to create 3D depth images with millimetre accuracy.
Fischer Connectors releases ultra-robust SPE and USB 3.2 Gen 2 connectivity solutions to meet the specific requirements of Industrial Internet of Things (IIoT) applications in rugged environments.
The edgeConnector products and the edgeAggregator from Softing Industrial offer a range of functionalities in version 3.40 that make integration into IT solutions much easier.
Mitsubishi Electric will highlight sweet spots for its smart solutions in the food packaging industry with a range of chocolate-filled demos at Interpack 2023 in Hall 6, Stand A40. From 4th-10th May, visitors will be able to learn how the company’s motto ‘Automating the World’ can be applied to drive the productivity and competitiveness of the consumer packaged goods (CPGs) sector.
Precision sensor manufacturer Micro-Epsilon has introduced a software adapter that enables easy, fast integration of the scanCONTROL series of laser profile sensors with Cognex VisionPro software via the Cognex AIK Server.