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CONGATEC PRESENTS APPLICATION-READY ECOSYSTEM FOR SMART AUTOMATION

congatec will present its extended range of application-ready building blocks for smart automation at Smart Factory + Automation World 2024 (Booth D243).

CONGATEC PRESENTS APPLICATION-READY ECOSYSTEM FOR SMART AUTOMATION

Premiered modules include Intel Core Ultra processor-based modules with integrated AI capabilities, and virtualization-ready Computer-on-Modules across all performance classes for system consolidation will also be featured. The presentations will focus on increased performance, energy efficiency, and integrated advanced IIoT and security functions, which have not been part of any existing Computer-on-Module (COM) offering before now. These will significantly increase the application readiness of COMs and contribute to the particularly efficient and reliable development of modern, multifunctional, and comprehensively connected embedded and IIoT devices and differentiate congatec's offering from alternative procurement options.

Embedded systems from OEMs must cover significantly more functionalities to meet all digitalization and IIoT connectivity requirements. congatec addresses these high demands on OEM solutions with its in-house hypervisor technologies and edge IoT functionalities, among other things. The advantages of the seamless integration of this range of solutions into the extended feature set of Computer-on-Modules will be presented by congatec for the first time at Smart Factory + Automation World.

The expanded IIoT functionality and OS implementation for Computer-on-Modules are the logical consequence of the company's value-added strategy: As one of the world's leading embedded and edge computing brands in the field of Computer-on-Modules, congatec is ultimately a pioneer when it comes to extended functions and services for the most simplified integration of COM Express, COM-HPC, SMARC and Qseven-based modules. Its high-performance ecosystem offers sophisticated cooling solutions optimized for the individual modules, carrier boards for easy evaluation and application design as well as accompanying software support and individual integration services. Moreover, congatec’s testing and design services save OEMs additional time and work. All this makes the integration of modules easier and more efficient and offers engineers a high level of design security. Customers benefit from faster time-to-market and can therefore master the ever-shorter innovation cycles in the best possible way.

In addition to covering all functional areas from processors to form factor, congatec modules offer OEMs comprehensive efficiency and convenience. The newly integrated virtualization, digitalization and security functions set a new benchmark in terms of the range of capabilities of application-ready Computer-on-Modules, especially for real-time IIoT applications.

Further information on the new presentations can be found on congatec's landing page for Smart Factory + Automation World.

www.congatec.com

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